FSP Group HYDRO GT PRO 3
New UCIe (Universal Chiplet Interconnect Express) Agreed by Intel, AMD, ARM, and Others
News
Intel, along with Advanced Semiconductor Engineering Inc. (ASE), AMD, Arm, Google Cloud, Meta, Microsoft Corp., Qualcomm Inc., Samsung and Taiwan Semiconductor Manufacturing Co., have announced。..
MediaTek Launches Dimensity 8000 5G Chip Series for Premium 5G Smartphones
News
MediaTek today launched the Dimensity 8100 and Dimensity 8000 system-on-chips (SoCs) to bring flagship level technology – connectivity, displays, gaming, multimedia and imaging features –。..