GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions announced the launch of the newest X570S AORUS series motherboards primed to unleash the potential of the recently released AMD Ryzen™ 5000 series desktop processors with enhanced DrMOS direct power design and 6 layers and above ultra cool PCB for higher stability. The whole series equip with a brand new passive chipset thermal design and up to four sets of high thermal efficiency armored PCIe 4.0 M.2 slots with M.2 Thermal Guard III, which ensures effective heat dissipation of full operation on chipsets and 7000MB/s high speed operating on NVMe SSDs without throttling by overheating. The brand new X570S series motherboards kick off the PCIe 4.0 era with extensive feature sets. The flagship X570S AORUS MASTER motherboard is fitted with a 16-phase direct digital power design for the more solid power management and optimized overclocking performance. With advanced heat dissipation technology of Fins-Array II Stacked Fins Heatsink, Direct Touch Heatpipe II and Smart Fan 6, GIGIABYTE X570S motherboards can maintain cool and high performance under high loading operation. Furthermore, GIGABYTE Active OC Tuner technology integrated in select motherboards to provide a more flexible performance improvement.
“AMD很兴奋，为新创新的X570主板推出，为AMD Socket AM4平台带来更多产品，”Chris Kilburn，Chris Kilburn，Chris Kilburn，Comperent Companial Component Business Obseral，AMD。“这些新的主板将继续展示AMD Ryzen™5000系列处理器的突破性性能，最大限度地提高爱好者，游戏玩家和内容创作者的潜力。”
整个X570S阵容集成了2.5 Gbe高速局域网，选择X570S Aorus主板功能WiFi 6带有炽热快速2.4 Gbps连接速度，甚至WiFi 6e 802.11ax无线网络，以及前USB 3.2 Type-C®界面进行更方便用法。此外，选择X570S Aorus主板装备USB 3.2 Gen 2×2 Type-C®，用于更快的数据传输高达20 Gbps。技嘉还释放了X570S Aero G for Creators。随着同一级电力材料，热规划，高速网络和4套PCIe 4.0 M.2接口作为其他X570S主板，X570S Aero G还具有由创作者提供良好接收的VisionLink功能为他们提供更有效的转变从创造的想法。
“为用户提供最好的产品一直been Gigabyte’s mission, while the top-quality AMD platform motherboards with excellent compatibility, high efficiency and low temperature demonstrates our strong strength in the development of AMD motherboards. “said Jackson Hsu, Director of the GIGABYTE Channel Solutions Product Development Division. “ GIGABYTE’s X570S series motherboards are developed by gamers and professional designers who pursue performance, and are enhanced by the features of 16-phase direct digital power design, advanced VRM thermal design, silent cooling design without chipset fan, several PCIe 4.0 interfaces, blazing fast LAN, updated BIOS, and R&D’s adjustment. This series definitely impress the performance chaser by the performance and stability and become the perfect choice for high-end users who plans to assemble AMD platforms. ”
Silent Thermal Design Demonstrates The Strong Hardware Design Power
With optimized hardware layouts design, GIGABYTE X570S motherboards equip with enlarged-surface chipset heatsink which enable the lineup upgrading to passive thermal design while maintain the same heat dissipation efficiency. This passive thermal design solve the noise problem of the X570 chipset fan, and further avoid dusting of the cooling fan which proves again GIGABYTE’s leading role in the industry. The X570S motherboards features several optimized thermal designs of Fins-ArrayII, Direct Touch Heatpipe II, exclusive M.2 Thermal Guard III with doubled-thickness and double-sided heighten heatsinks on the M.2 SSD, which can boost thermal performance in a silent way. Further enhanced by Hybrid fans, multiple temperature detections, dual fan curves of 7-phase adjustment modes, and smart fan control of Smart Fan 6 Technology, promising the processor, VRM, chipset, or even the highest speed of 7000MB/s Gen4 M.2 SSD with no throttling or performance reduce by overheating.
Enhanced Stability Of Power Supply And The Convenience Of Dynamic Overclocking
In addition to the improvements on thermal design, GIGABYTE also greatly enhanced the power supply design of the X570S motherboards to perfectly release the ultimate performance of AMD Ryzen™ 5000 series processors. GIGABYTE packs at least 14 phases digital power design on each ATX board in X570S AORUS Series. Applying to different requests of power consumption, GIGABYTE uses MOSFETs of upmost 90A Smart Power Stage or DrMOS to ensure a more stable current flow, better power and thermal management while the CPU is running at its full potential, which can perfectly unleash the extreme performance and overclocking power of processors.
高端型号X570S Aorus Master拥有一个16相直接数字功率设计，每个功率级阶段能够管理最多70A的阻抗，并改善电源阶段的加载平衡，就像旗舰型X570 Aorus Xtreme主板一样。通过16阶段使用，通过每个阶段均匀地处理电力需求，以避免一个单相的长时间高负载操作，进一步降低热量和功耗。这提高了主板的整体功率效率，耐用性和使用寿命，使用户能够最大化AMD Ryzen™5000台式机上的超频电位，而无需超频故障或由不稳定或过热的电源引起的性能降低的担忧。
X570S AORUS MASTER, AORUS PRO AX and AERO G models are particularly equipped with GIGABYTE’s newly developed the Active OC Tuner active overclocking technology. The CPU overclocking frequency and the number of operating cores can be dynamically switched between the default precise-overclocking function PBO (Precision Boost Overdrive) and manual overclocking according to different requirements of current configuration and characteristics of running applications. This technology allows user to execute corresponding application by frequency and core numbers to enjoy the maximum performance. Users have no need to confirm the loading or whether it requires multi-cores before running different applications then struggle in the BIOS to switch between PBO and manual overclocking. With GIGABYTE Active OC Tuner active overclocking technology, users can have it both ways once they activate this function to enjoy the advantages of optimized automatic overclocking settings and an more enjoyable system operation with ease.
Storage Performance Boost By Advanced PCIe 4.0 Interface
Gigabyte X570S Aorus主板拥有PCIe 4.0的性能潜力，并优化其主板的设计，以提高外围部件的性能。设计功能，如6层及以上，具有较低电感的2倍铜PCB，以及选择模型的PCIe 4.0 B-CLK IC，以最大化PCIe带宽，随着PCIe存储设备上的数据传输容量，从CPU增加超频性能记忆。主板在外围元件上解锁隐藏的性能电位，允许在这些设备上燃烧快速传输速度。Gigabyte X570S阵容使资本从CPU和X570芯片组中脱离PCIe 4.0接口，使用四个PCIe 4.0 M.2插槽在选择型号上，通过构建RAID阵列来同时运行四组AORUS 7000s SSD以进行令人印象深刻的存储性能。增强的M.2热防护装置III也成功减少了热节流的机会，并允许用户充分利用新的PCIe 4.0接口。
More Flexible Ethernet and WIFI Network With Easier High-Speed Transfer Expansions
The entire X570S lineup offers a 2.5 Gbps Ethernet connection speeds for gamers to have the faster and more stable wired network connectivity. All WIFI enabled models in the lineup feature the Intel® Wi-Fi 6 802.11ax standard which delivers blazing fast 2.4 Gbps connection speeds that almost rival the 2.5 Gbps Ethernet connection speeds. X570S AORUS MASTER further builds in Intel® Wi-Fi 6E 802.11ax network with 6 GHz frequency bands for a smoother connections. With both high-speed Ethernet and WIFI, users have extra flexibility and ridiculously fast connection speeds. X570S lineup also integrates front USB 3.2 Type-C® interface for enhanced convenience while select AORUS X570S series motherboards adopt USB 3.2 Gen 2×2 Type-C® with up to 20 Gbps bandwidth for ultrafast transfer speed. With GIGABYTE VISION DRIVE 1TB external SSD, users can get the full benefit from this high-speed transmission.
Fan favorite and well-received features make their return to GIGABYTE X570S motherboards. Sleek aesthetics design, RGB Fusion LED lighting, Ultra durable quality, Hi-Fi audio, and many more trademark features have been further refined and added to the mix with AMD’s built-in features. The entire X570S lineup comes with the newest version of Q-Flash Plus Technology. Users can easily update the BIOS without even installing a processor, memory, graphics cards, or booting up the PC so they can flash the BIOS and have no worries about not being able to boot up the system due to an unsupported BIOS version.
The Innovative X570S AERO G For Creators
GIGABYTE integrated the AERO and VISION products for creators into the AERO series to integrate product series names and increase market focus, as well as maximizing brand management and consumer product marketing strategies. Starting from the AMD platform, X570S AERO G will be released concurrently as X570S series, and the VISION series will become a part of AERO.
新X570S AERO G采用全数字14阶段power supply of high-quality Intersil PWM controller with 60 Amps per phase DrMOS design, and equips with the new fully covered heat sink of twice heat dissipation area to provide more stable and ultra cool power supply. X570S AERO G features full functions exclusive for creators, with four sets of thermal-armored PCIe 4.0 M.2 slots, promising no throttling under the overheat by heavy operation. X570S AERO G also adopts renowned VisionLINK technology, which allows for data and video transmission based on USB Type-C® cable and provides pen displays power delivery up to 60W. VisionLINK technology brings the benefit of easy data transfer and convenient power charging to creators without cable clutter, which save them more time and effort for the content creation. Meanwhile, the features of 2.5 GbE Ethernet, Intel® Wi-Fi 6 802.11ax wireless network, USB 3.2 Gen 2×2 Type-C®, front Type-C® interface, and Active OC Tuner technology enable a great improvement on work efficiency for creators.
GIGABYTE X570S series motherboards use only the finest components reinforced by GIGABYTE Ultra Durable™ Technology with comprehensive functions. This series become the excellent choice for users seeking to build a high-end PC system and enjoy the GIGABYTE’s exclusive technologies have to offer. Interested in learning more about the X570S lineup? Please visit the official website for more information! https://www.gigabyte.com/tw/Motherboard/Socket-AM4
